Indium Company World Account Supervisor and Senior Thermal Technologist Tim Jensen will current a technical paper at SEMI-THERM, happening March 13–17 in San Jose, CA.
The presentation, titled Modern Subsequent Technology Steel TIM Know-how for HPC Functions, will handle using solder thermal interface supplies (sTIMs) for warmth dissipation in high-performance computing (HPC) purposes. sTIMs have been used as a TIM1 answer for a restricted set of server packages for over 20 years. A sTIM interface has the potential to supply extraordinarily excessive quantities of warmth dissipation. Due to rising energy and performance of HPC packages, most of the conventional polymer TIM supplies are reaching their bodily limits for warmth dissipation and are not satisfactory. That is creating an curiosity in utilizing metallic TIMs in a broader array of purposes.
At Indium Company, Jensen leads a matrixed workforce centered on participating prospects and commercializing new know-how for our Thermal Interface Materials merchandise, together with know-how for 5G and AI. He’s liable for making certain the product line is poised for long-term success by growing applied sciences that finest meet the present and future wants of consumers. He has authored quite a few technical papers on soldering and thermal know-how. Along with his tasks at Indium Company, Jensen additionally serves on the SMTA’s Board of Administrators. On this function, he’s a part of the Strategic Growth Committee the place he leads the trouble on worldwide enlargement. He has a bachelor’s diploma in chemical engineering from Clarkson College and an MBA from Syracuse College.
Supply: https://www.indium.com/
